Identificador persistente para citar o vincular este elemento: http://hdl.handle.net/10553/75569
Título: Experimental study of free convective heat transfer around a spherical electronic component cooled by means of porous media saturated by nanofluid
Autores/as: Baïri, Abderrahmane
Alilat, Nacim
Déniz Quintana, Fabian Alberto 
Clasificación UNESCO: 332816 Transferencia de calor
Palabras clave: Electronics Thermal Engineering
Experimental Heat Transfer
Nanofluid
Natural Convection
Porous Media, et al.
Fecha de publicación: 2020
Publicación seriada: Heat and Mass Transfer/Waerme- und Stoffuebertragung 
Resumen: This experimental work deals with quantification of free convective heat transfer around a spherical electronic device. This so-called active sphere generates during its operation a heat flux leading to Rayleigh number ranging from 6.84 × 106 to 9.79 × 108. Its cooling is done through porous media saturated by Water-ZnO nanofluid contained in a spherical closed cavity maintained isothermal. Steady state measurements were carried out on an industrial prototype at scale 1:1 using various porous media whose thermal conductivity, relative to that of the base heat transfer fluid (water), varies between 0 (without porous medium) and about 40. These porous media are saturated with a water-based ZnO nanoparticles nanofluid with a volume fraction ranging from 0 (pure water) to 10%. The average Nusselt number determined for different combinations of the three influencing parameters confirms that saturated porous media enhances natural convective heat transfer. Influences of Rayleigh number, volume fraction and thermal conductivity ratio have been quantified. Results are in agreement with those of recent numerical approaches done by means of the control volume method in the 6.51 × 106 - 1.32 × 109 Rayleigh number range. Measurement-calculation deviations are of about 5% on average. They confirm the validity of the model implemented in the numerical approach. The new results of the present work can be applied to various engineering fields such as electronics to optimize thermal design of electronic assemblies and improve their reliability.
URI: http://hdl.handle.net/10553/75569
ISSN: 0947-7411
DOI: 10.1007/s00231-020-02908-8
Fuente: Heat and Mass Transfer/Waerme- und Stoffuebertragung[ISSN 0947-7411], v. 56, p. 3085–3092
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