Please use this identifier to cite or link to this item: http://hdl.handle.net/10553/75569
Title: Experimental study of free convective heat transfer around a spherical electronic component cooled by means of porous media saturated by nanofluid
Authors: Baïri, Abderrahmane
Alilat, Nacim
Déniz Quintana, Fabian Alberto 
UNESCO Clasification: 332816 Transferencia de calor
Keywords: Electronics Thermal Engineering
Experimental Heat Transfer
Nanofluid
Natural Convection
Porous Media, et al
Issue Date: 2020
Journal: Heat and Mass Transfer/Waerme- und Stoffuebertragung 
Abstract: This experimental work deals with quantification of free convective heat transfer around a spherical electronic device. This so-called active sphere generates during its operation a heat flux leading to Rayleigh number ranging from 6.84 × 106 to 9.79 × 108. Its cooling is done through porous media saturated by Water-ZnO nanofluid contained in a spherical closed cavity maintained isothermal. Steady state measurements were carried out on an industrial prototype at scale 1:1 using various porous media whose thermal conductivity, relative to that of the base heat transfer fluid (water), varies between 0 (without porous medium) and about 40. These porous media are saturated with a water-based ZnO nanoparticles nanofluid with a volume fraction ranging from 0 (pure water) to 10%. The average Nusselt number determined for different combinations of the three influencing parameters confirms that saturated porous media enhances natural convective heat transfer. Influences of Rayleigh number, volume fraction and thermal conductivity ratio have been quantified. Results are in agreement with those of recent numerical approaches done by means of the control volume method in the 6.51 × 106 - 1.32 × 109 Rayleigh number range. Measurement-calculation deviations are of about 5% on average. They confirm the validity of the model implemented in the numerical approach. The new results of the present work can be applied to various engineering fields such as electronics to optimize thermal design of electronic assemblies and improve their reliability.
URI: http://hdl.handle.net/10553/75569
ISSN: 0947-7411
DOI: 10.1007/s00231-020-02908-8
Source: Heat and Mass Transfer/Waerme- und Stoffuebertragung[ISSN 0947-7411], v. 56, p. 3085–3092
Appears in Collections:Artículos
Show full item record

SCOPUSTM   
Citations

8
checked on Oct 13, 2024

WEB OF SCIENCETM
Citations

7
checked on Oct 13, 2024

Page view(s)

101
checked on May 18, 2024

Google ScholarTM

Check

Altmetric


Share



Export metadata



Items in accedaCRIS are protected by copyright, with all rights reserved, unless otherwise indicated.