Please use this identifier to cite or link to this item: http://hdl.handle.net/10553/70111
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dc.contributor.authorGonzález-Domínguez, Pablo Ignacioen_US
dc.contributor.authorMonzón-Verona, José Miguelen_US
dc.contributor.authorGarcía-Alonso, Santiagoen_US
dc.date.accessioned2020-02-05T12:52:29Z-
dc.date.available2020-02-05T12:52:29Z-
dc.date.issued2019en_US
dc.identifier.issn2076-3417en_US
dc.identifier.otherScopus-
dc.identifier.urihttp://hdl.handle.net/10553/70111-
dc.description.abstractIn this paper, a new constitutive matrix [Mτ] for thermal conduction, for tetrahedral meshes, in a steady state thermal regime is developed through a new algebraic methodology, using the Cell Method as a computational method, which is included in the finite formulation. The constitutive matrix defines the behavior of solids when they are under a thermal potential. The results are compared with those obtained for the same problem by means of the constitutive matrix [Mλ] developed previously, taking in both cases with a 2D axisymmetric model as reference, calculated with the finite element method. The errors obtained with the new matrix [Mτ] are of the order of 0.0025%, much lower than those obtained with the matrix [Mλ].en_US
dc.languageengen_US
dc.relation.ispartofApplied Sciences (Basel)en_US
dc.sourceApplied Sciences [ISSN 2076-3417], v. 9 (21)en_US
dc.subject3306 Ingeniería y tecnología eléctricasen_US
dc.subject.otherAnalytical Methoden_US
dc.subject.otherCell Methoden_US
dc.subject.otherComputational Techniqueen_US
dc.subject.otherFemen_US
dc.subject.otherHeat Conductionen_US
dc.subject.otherThermal Constitutive Matrixen_US
dc.titleNew thermal-conductivity constitutive matrix in fourier's law for heat transfer using the cell methoden_US
dc.typeinfo:eu-repo/semantics/articleen_US
dc.typeArticleen_US
dc.identifier.doi10.3390/app9214521en_US
dc.identifier.scopus85075252916-
dc.identifier.isi000498058600046-
dc.contributor.authorscopusid57203973366-
dc.contributor.authorscopusid26531597500-
dc.contributor.authorscopusid35106946100-
dc.identifier.eissn2076-3417-
dc.identifier.issue21-
dc.relation.volume9en_US
dc.investigacionIngeniería y Arquitecturaen_US
dc.type2Artículoen_US
dc.contributor.daisngid29126516-
dc.contributor.daisngid5659103-
dc.contributor.daisngid33177935-
dc.description.numberofpages19en_US
dc.utils.revisionen_US
dc.contributor.wosstandardWOS:Gonzalez-Dominguez, PI-
dc.contributor.wosstandardWOS:Monzon-Verona, JM-
dc.contributor.wosstandardWOS:Garcia-Alonso, S-
dc.date.coverdateNoviembre 2019en_US
dc.identifier.ulpgces
dc.description.sjr0,418
dc.description.jcr2,474
dc.description.sjrqQ1
dc.description.jcrqQ2
dc.description.scieSCIE
item.grantfulltextopen-
item.fulltextCon texto completo-
crisitem.author.deptGIR IUMA: Instrumentación avanzada-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Eléctrica-
crisitem.author.deptGIR IUMA: Instrumentación avanzada-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Eléctrica-
crisitem.author.deptGIR IUMA: Instrumentación avanzada-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Electrónica y Automática-
crisitem.author.orcid0000-0001-9694-269X-
crisitem.author.orcid0000-0003-4389-0632-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.fullNameGonzález Domínguez, Pablo-
crisitem.author.fullNameMonzón Verona, José Miguel-
crisitem.author.fullNameGarcia-Alonso Montoya, Santiago-
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New thermal-conductivity constitutive matrix in fourier's law for heat transfer using the cell method
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