Please use this identifier to cite or link to this item: http://hdl.handle.net/10553/47599
DC FieldValueLanguage
dc.contributor.authorDel Pino, J.en_US
dc.contributor.authorDiaz, R.en_US
dc.contributor.authorKhemchandani, S. L.en_US
dc.contributor.otherdel Pino, Javier-
dc.date.accessioned2018-11-23T14:51:05Z-
dc.date.available2018-11-23T14:51:05Z-
dc.date.issued2010en_US
dc.identifier.issn1434-8411en_US
dc.identifier.urihttp://hdl.handle.net/10553/47599-
dc.description.abstractThis paper presents two techniques to reduce the area in the design of CMOS distributed amplifiers. The proposed techniques take into account the influence of compacting the layout and the use of stacked inductor for the artificial transmission lines on the distributed amplifier performance. Following these design guidelines, three prototypes have been fabricated in a low cost CMOS 0 35 mu m process. The measured gain is about 6 dB with a cutoff frequency around 8 GHz. The noise figure varies from 5 to 7 dB and the circuits draw 30 mA from a 3.3 V voltage supply. With the developed area optimization design techniques, a maximum area reduction of 37% with respect to a conventional design has been achieved, without any significant performance degradation. (C) 2010 Elsevier GmbH All rights reserved.en_US
dc.languageengen_US
dc.publisher1434-8411-
dc.relation.ispartofAEU - International Journal of Electronics and Communicationsen_US
dc.sourceAEU - International Journal of Electronics and Communications[ISSN 1434-8411],v. 64, p. 1055-1062en_US
dc.subject3307 Tecnología electrónicaen_US
dc.subject.otherSpiral Inductorsen_US
dc.subject.otherCmosen_US
dc.subject.otherTechnologyen_US
dc.subject.otherDesignen_US
dc.titleArea reduction techniques for full integrated distributed amplifieren_US
dc.typeinfo:eu-repo/semantics/Articleen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.aeue.2009.12.006en_US
dc.identifier.scopus77957252968-
dc.identifier.isi000283705800008-
dcterms.isPartOfAeu-International Journal Of Electronics And Communications-
dcterms.sourceAeu-International Journal Of Electronics And Communications[ISSN 1434-8411],v. 64 (11), p. 1055-1062-
dc.contributor.authorscopusid56740582700-
dc.contributor.authorscopusid7201925868-
dc.contributor.authorscopusid9639770800-
dc.description.lastpage1062en_US
dc.description.firstpage1055en_US
dc.relation.volume64en_US
dc.investigacionIngeniería y Arquitecturaen_US
dc.type2Artículoen_US
dc.identifier.wosWOS:000283705800008-
dc.contributor.daisngid1188406-
dc.contributor.daisngid7787299-
dc.contributor.daisngid1425987-
dc.identifier.investigatorRIDA-6677-2008-
dc.utils.revisionen_US
dc.contributor.wosstandardWOS:del Pino, J-
dc.contributor.wosstandardWOS:Diaz, R-
dc.contributor.wosstandardWOS:Khemchandani, SL-
dc.date.coverdateNoviembre 2010en_US
dc.identifier.ulpgces
dc.description.jcr0,519
dc.description.jcrqQ3
dc.description.scieSCIE
item.grantfulltextnone-
item.fulltextSin texto completo-
crisitem.author.deptGIR IUMA: Tecnología Microelectrónica-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Electrónica y Automática-
crisitem.author.deptGIR IUMA: Tecnología Microelectrónica-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Electrónica y Automática-
crisitem.author.orcid0000-0003-2610-883X-
crisitem.author.orcid0000-0003-0087-2370-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.fullNameDel Pino Suárez, Francisco Javier-
crisitem.author.fullNameKhemchandani Lalchand, Sunil-
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