Please use this identifier to cite or link to this item: http://hdl.handle.net/10553/45071
DC FieldValueLanguage
dc.contributor.authorEsper-Chaín, R.en_US
dc.contributor.authorTobajas, F.en_US
dc.contributor.authorSarmiento, R.en_US
dc.contributor.otherSarmiento, Roberto-
dc.date.accessioned2018-11-22T07:02:51Z-
dc.date.available2018-11-22T07:02:51Z-
dc.date.issued2002en_US
dc.identifier.issn0026-2692en_US
dc.identifier.urihttp://hdl.handle.net/10553/45071-
dc.description.abstractToday's data communication systems are demanding increasing off-chip data rates. To satisfy this demand, high-speed serial links are used, saving area and power dissipation compared to highly parallel buses. However, power dissipation and noise generated by this system is still a critical issue. In this article, a novel approach using differential current mode is presented, which combines low power dissipation with low noise generated due to the reduced power transmission.en_US
dc.languageengen_US
dc.publisher0026-2692-
dc.relation.ispartofMicroelectronicsen_US
dc.sourceMicroelectronics Journal[ISSN 0026-2692],v. 33, p. 1107-1114en_US
dc.subject3307 Tecnología electrónicaen_US
dc.subject.otherHigh-speed serial linksen_US
dc.subject.otherDifferential current modeen_US
dc.subject.otherPower dissipationen_US
dc.titleDifferential current mode serial link for 2 Gb/s in GaAs technologyen_US
dc.typeinfo:eu-repo/semantics/articleen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/S0026-2692(02)00116-7en_US
dc.identifier.scopus0036897004-
dc.identifier.isi000179840200010-
dcterms.isPartOfMicroelectronics Journal-
dcterms.sourceMicroelectronics Journal[ISSN 0026-2692],v. 33 (12), p. 1107-1114-
dc.contributor.authorscopusid6602504574-
dc.contributor.authorscopusid6602389338-
dc.contributor.authorscopusid35609452100-
dc.description.lastpage1114-
dc.description.firstpage1107-
dc.relation.volume33-
dc.investigacionIngeniería y Arquitecturaen_US
dc.type2Artículoen_US
dc.identifier.wosWOS:000179840200010-
dc.contributor.daisngid1984698-
dc.contributor.daisngid800751-
dc.contributor.daisngid116294-
dc.identifier.investigatorRIDL-6017-2014-
dc.utils.revisionen_US
dc.identifier.ulpgces
dc.description.jcr0,457
dc.description.jcrqQ3
dc.description.scieSCIE
item.grantfulltextnone-
item.fulltextSin texto completo-
crisitem.author.deptGIR IUMA: Equipos y Sistemas de Comunicación-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Electrónica y Automática-
crisitem.author.deptGIR IUMA: Sistemas de Información y Comunicaciones-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Electrónica y Automática-
crisitem.author.deptGIR IUMA: Diseño de Sistemas Electrónicos Integrados para el procesamiento de datos-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Electrónica y Automática-
crisitem.author.orcid0000-0002-8381-969X-
crisitem.author.orcid0000-0002-3379-5052-
crisitem.author.orcid0000-0002-4843-0507-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.fullNameEsper-Chaín Falcón, Roberto-
crisitem.author.fullNameTobajas Guerrero, Félix Bernardo-
crisitem.author.fullNameSarmiento Rodríguez, Roberto-
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