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Please use this identifier to cite or link to this item: http://hdl.handle.net/10553/42473
DC FieldValueLanguage
dc.contributor.authorMonagas Martín, Jorgeen_US
dc.contributor.authorSarmiento Nevado, Artemien_US
dc.contributor.authorVega Martínez, Aurelioen_US
dc.date.accessioned2018-11-15T13:28:05Z-
dc.date.available2018-11-15T13:28:05Z-
dc.date.issued2016en_US
dc.identifier.isbn9781509022649en_US
dc.identifier.otherWoS-
dc.identifier.otherScopus-
dc.identifier.urihttp://hdl.handle.net/10553/42473-
dc.description.abstractAn In-Circuit Test machine (ICT) is a tool to carry out electrical tests on already assembled printed circuits through a set of probes making contact on some selected circuit nodes to monitorize their electrical signals or to induce electrical states at those nodes. This paper introduces the hardware, software and mechanical development of a low cost modular test system to make In-Circuit Test (ICT) intended for electronic prototypes of small and medium manufacturing series.en_US
dc.languageengen_US
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en_US
dc.sourceProceedings of 2016 Technologies Applied to Electronics Teaching, TAEE 2016, (Agosto 2016), p. 1-7en_US
dc.subject3325 Tecnología de las telecomunicacionesen_US
dc.subject.otherCommunication busesen_US
dc.subject.otherElectronics instrumentationen_US
dc.subject.otherEmbedded systemsen_US
dc.subject.otherIn-circuit testen_US
dc.titleLow cost programmable modular system to perform In-Circuit Test (ICT) full development of the hardware, software and mechanics of an ICT machineen_US
dc.typeinfo:eu-repo/semantics/conferenceObjecten_US
dc.typeConferenceObjecten_US
dc.relation.conferenceConference on Technologies Applied to Electronics Teaching (TAEE)en_US
dc.identifier.doi10.1109/TAEE.2016.7528359en_US
dc.identifier.scopus84992034612-
dc.identifier.isi000383221600022-
dc.contributor.authorscopusid57191611181-
dc.contributor.authorscopusid57191621453-
dc.contributor.authorscopusid57191612432-
dc.investigacionIngeniería y Arquitecturaen_US
dc.type2Actas de congresosen_US
dc.contributor.daisngid32318210-
dc.contributor.daisngid3965355-
dc.contributor.daisngid11998526-
dc.description.numberofpages7en_US
dc.identifier.eisbn978-1-5090-2264-9-
dc.utils.revisionSíen_US
dc.contributor.wosstandardWOS:Martin, JEM-
dc.contributor.wosstandardWOS:Nevado, AS-
dc.contributor.wosstandardWOS:Martinez, AV-
dc.date.coverdateAgosto 2016en_US
dc.identifier.conferenceidevents120991-
dc.identifier.ulpgcSíen_US
dc.contributor.buulpgcBU-TELen_US
item.fulltextSin texto completo-
item.grantfulltextnone-
crisitem.author.deptGIR IUMA: Sistemas de Información y Comunicaciones-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Electrónica y Automática-
crisitem.author.deptGIR IUMA: Sistemas de Información y Comunicaciones-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Electrónica y Automática-
crisitem.author.orcid0000-0002-2119-5703-
crisitem.author.orcid0000-0002-4154-8799-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.fullNameMonagas Martín, Jorge-
crisitem.author.fullNameVega Martínez, Aurelio-
crisitem.event.eventsstartdate22-06-2016-
crisitem.event.eventsenddate24-06-2016-
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