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Please use this identifier to cite or link to this item: http://hdl.handle.net/10553/117837
DC FieldValueLanguage
dc.contributor.authorVega García, Carlos-
dc.contributor.authorVega Martínez, Aurelio-
dc.contributor.authorMerino Fernández, Irene-
dc.contributor.authorPérez Báez, Oscar-
dc.date.accessioned2022-08-29T08:19:03Z-
dc.date.available2022-08-29T08:19:03Z-
dc.date.issued2022-
dc.identifier.isbn978-1-6654-2161-4-
dc.identifier.issn2766-2616-
dc.identifier.otherScopus-
dc.identifier.urihttp://hdl.handle.net/10553/117837-
dc.description.abstractA cost-effective machine is presented to automatically carry out PCBs' optical, electrical, and thermal inspection. It can generate high-resolution composite images and perform automated voltage and temperature measurements at any point in the work area. Its use is designed for teaching and research environments, although it is also helpful in a repair workshop for troubleshooting.-
dc.languageeng-
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)-
dc.relation.ispartofTechnologies Applied to Electronics Teaching-
dc.source2022 Congreso de Tecnología, Aprendizaje y Enseñanza de la Electrónica (XV Technologies Applied to Electronics Teaching Conference)-
dc.subject3307 Tecnología electrónica-
dc.subject.otherTemperature measurement-
dc.subject.otherVoltage measurement-
dc.subject.otherEducation-
dc.subject.otherMaintenance engineering-
dc.subject.otherOptical imaging-
dc.subject.otherWind turbines-
dc.subject.otherTelecommunications-
dc.titleAutomatic lab system for optical, electrical, and thermal inspection of PCBs-
dc.typeinfo:eu-repo/semantics/conferenceobject-
dc.relation.conferenceXV International Conference of Technology, Learning and Teaching of Electronics (TAEE 2022)-
dc.identifier.doi10.1109/TAEE54169.2022.9840735-
dc.identifier.scopus85137077364-
dc.contributor.orcid0000-0002-5629-1471-
dc.contributor.orcid0000-0002-4154-8799-
dc.contributor.orcid0000-0003-4380-6402-
dc.contributor.orcid#NODATA#-
dc.contributor.authorscopusid57869963900-
dc.contributor.authorscopusid56405149600-
dc.contributor.authorscopusid57870109900-
dc.contributor.authorscopusid57870412100-
dc.investigacionIngeniería y Arquitectura-
dc.type2Actas de congresos-
dc.identifier.external117029719-
dc.utils.revisionSí-
dc.date.coverdateEnero 2022-
dc.identifier.conferenceidevents149099-
dc.identifier.ulpgcSí-
dc.contributor.buulpgcBU-ING-
item.fulltextCon texto completo-
item.grantfulltextopen-
crisitem.author.deptGIR IUMA: Diseño de Sistemas Electrónicos Integrados para el procesamiento de datos-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptGIR IUMA: Sistemas de Información y Comunicaciones-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Electrónica y Automática-
crisitem.author.deptGIR IUMA: Tecnología Microelectrónica-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.orcid0000-0002-5629-1471-
crisitem.author.orcid0000-0002-4154-8799-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.fullNameVega García, Carlos-
crisitem.author.fullNameVega Martínez, Aurelio-
crisitem.author.fullNameMerino Fernández, Irene-
crisitem.event.eventsstartdate06-09-2010-
crisitem.event.eventsenddate08-09-2010-
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