Please use this identifier to cite or link to this item: http://hdl.handle.net/10553/105793
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dc.contributor.authorMelián Álamo, José Maríaen_US
dc.contributor.authorJiménez Delgado, Adán Enriqueen_US
dc.contributor.authorDíaz Martín, Maríaen_US
dc.contributor.authorMorales Carreño, Alejandroen_US
dc.contributor.authorHorstrand Andaluz, Pablo Sebastianen_US
dc.contributor.authorGuerra Hernández, Raúl Celestinoen_US
dc.contributor.authorLópez Suárez, Sebastiánen_US
dc.contributor.authorLópez Feliciano, José Franciscoen_US
dc.date.accessioned2021-03-16T09:20:54Z-
dc.date.available2021-03-16T09:20:54Z-
dc.date.issued2021en_US
dc.identifier.issn2072-4292en_US
dc.identifier.otherScopus-
dc.identifier.urihttp://hdl.handle.net/10553/105793-
dc.description.abstractHyperspectral sensors that are mounted in unmanned aerial vehicles (UAVs) offer many benefits for different remote sensing applications by combining the capacity of acquiring a high amount of information that allows for distinguishing or identifying different materials, and the flexibility of the UAVs for planning different kind of flying missions. However, further developments are still needed to take advantage of the combination of these technologies for applications that require a supervised or semi-supervised process, such as defense, surveillance, or search and rescue missions. The main reason is that, in these scenarios, the acquired data typically need to be rapidly transferred to a ground station where it can be processed and/or visualized in real-time by an operator for taking decisions on the fly. This is a very challenging task due to the high acquisition data rate of the hyperspectral sensors and the limited transmission bandwidth. This research focuses on providing a working solution to the described problem by rapidly compressing the acquired hyperspectral data prior to its transmission to the ground station. It has been tested using two different NVIDIA boards as on-board computers, the Jetson Xavier NX and the Jetson Nano. The Lossy Compression Algorithm for Hyperspectral Image Systems (HyperLCA) has been used for compressing the acquired data. The entire process, including the data compression and transmission, has been optimized and parallelized at different levels, while also using the Low Power Graphics Processing Units (LPGPUs) embedded in the Jetson boards. Finally, several tests have been carried out to evaluate the overall performance of the proposed design. The obtained results demonstrate the achievement of real-time performance when using the Jetson Xavier NX for all the configurations that could potentially be used during a real mission. However, when using the Jetson Nano, real-time performance has only been achieved when using the less restrictive configurations, which leaves room for further improvements and optimizations in order to reduce the computational burden of the overall design and increase its efficiency.en_US
dc.languageengen_US
dc.relationPlataforma H2/Sw Distribuida Para El Procesamiento Inteligente de Información Sensorial Heterogenea en Aplicaciones de Supervisión de Grandes Espacios Naturalesen_US
dc.relationAgricultura de Precisión para la Mejora de la Producción Vitícola en la Macaronesiaen_US
dc.relation.ispartofRemote Sensingen_US
dc.sourceRemote Sensing [EISSN 2072-4292], v. 13 (5), 850, (Marzo 2021)en_US
dc.subject3307 Tecnología electrónicaen_US
dc.subject.otherHyperspectral Imagesen_US
dc.subject.otherOn-Board Compressionen_US
dc.subject.otherReal-Time Compressionen_US
dc.subject.otherReal-Time Transmissionen_US
dc.subject.otherUavsen_US
dc.titleReal-Time Hyperspectral Data Transmission for UAV-Based Acquisition Platformsen_US
dc.typeinfo:eu-repo/semantics/articleen_US
dc.typeArticleen_US
dc.identifier.doi10.3390/rs13050850en_US
dc.identifier.scopus85102741556-
dc.contributor.authorscopusid57219651540-
dc.contributor.authorscopusid57214668146-
dc.contributor.authorscopusid57192832495-
dc.contributor.authorscopusid57214830931-
dc.contributor.authorscopusid54399861900-
dc.contributor.authorscopusid56333613300-
dc.contributor.authorscopusid57187722000-
dc.contributor.authorscopusid7404444793-
dc.identifier.eissn2072-4292-
dc.description.lastpage24en_US
dc.identifier.issue5-
dc.description.firstpage1en_US
dc.relation.volume13en_US
dc.investigacionIngeniería y Arquitecturaen_US
dc.type2Artículoen_US
dc.description.notasThis article belongs to the Special Issue Remote Sensing Data Compressionen_US
dc.utils.revisionen_US
dc.date.coverdateMarzo 2021en_US
dc.identifier.ulpgcen_US
dc.contributor.buulpgcBU-TELen_US
dc.description.sjr1,283
dc.description.jcr5,349
dc.description.sjrqQ1
dc.description.jcrqQ1
dc.description.scieSCIE
dc.description.miaricds10,6
item.grantfulltextopen-
item.fulltextCon texto completo-
crisitem.author.deptGIR IUMA: Diseño de Sistemas Electrónicos Integrados para el procesamiento de datos-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptGIR IUMA: Diseño de Sistemas Electrónicos Integrados para el procesamiento de datos-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptGIR IUMA: Diseño de Sistemas Electrónicos Integrados para el procesamiento de datos-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Eléctrica-
crisitem.author.deptGIR IUMA: Diseño de Sistemas Electrónicos Integrados para el procesamiento de datos-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptGIR IUMA: Diseño de Sistemas Electrónicos Integrados para el procesamiento de datos-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Electrónica y Automática-
crisitem.author.deptGIR IUMA: Diseño de Sistemas Electrónicos Integrados para el procesamiento de datos-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Electrónica y Automática-
crisitem.author.orcid0000-0003-2670-8149-
crisitem.author.orcid0000-0001-7404-3028-
crisitem.author.orcid0000-0002-4303-3051-
crisitem.author.orcid0000-0002-2360-6721-
crisitem.author.orcid0000-0002-6304-2801-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.fullNameMelián Álamo, José María-
crisitem.author.fullNameDíaz Martín,María-
crisitem.author.fullNameMorales Carreño, Alejandro-
crisitem.author.fullNameHorstrand Andaluz, Pablo Sebastian-
crisitem.author.fullNameGuerra Hernández,Raúl Celestino-
crisitem.author.fullNameLópez Suárez, Sebastián Miguel-
crisitem.author.fullNameLópez Feliciano, José Francisco-
crisitem.project.principalinvestigatorLópez Suárez, Sebastián Miguel-
crisitem.project.principalinvestigatorLópez Feliciano, José Francisco-
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