Identificador persistente para citar o vincular este elemento:
http://hdl.handle.net/10553/75569
Título: | Experimental study of free convective heat transfer around a spherical electronic component cooled by means of porous media saturated by nanofluid | Autores/as: | Baïri, Abderrahmane Alilat, Nacim Déniz Quintana, Fabian Alberto |
Clasificación UNESCO: | 332816 Transferencia de calor | Palabras clave: | Electronics Thermal Engineering Experimental Heat Transfer Nanofluid Natural Convection Porous Media, et al. |
Fecha de publicación: | 2020 | Publicación seriada: | Heat and Mass Transfer/Waerme- und Stoffuebertragung | Resumen: | This experimental work deals with quantification of free convective heat transfer around a spherical electronic device. This so-called active sphere generates during its operation a heat flux leading to Rayleigh number ranging from 6.84 × 106 to 9.79 × 108. Its cooling is done through porous media saturated by Water-ZnO nanofluid contained in a spherical closed cavity maintained isothermal. Steady state measurements were carried out on an industrial prototype at scale 1:1 using various porous media whose thermal conductivity, relative to that of the base heat transfer fluid (water), varies between 0 (without porous medium) and about 40. These porous media are saturated with a water-based ZnO nanoparticles nanofluid with a volume fraction ranging from 0 (pure water) to 10%. The average Nusselt number determined for different combinations of the three influencing parameters confirms that saturated porous media enhances natural convective heat transfer. Influences of Rayleigh number, volume fraction and thermal conductivity ratio have been quantified. Results are in agreement with those of recent numerical approaches done by means of the control volume method in the 6.51 × 106 - 1.32 × 109 Rayleigh number range. Measurement-calculation deviations are of about 5% on average. They confirm the validity of the model implemented in the numerical approach. The new results of the present work can be applied to various engineering fields such as electronics to optimize thermal design of electronic assemblies and improve their reliability. | URI: | http://hdl.handle.net/10553/75569 | ISSN: | 0947-7411 | DOI: | 10.1007/s00231-020-02908-8 | Fuente: | Heat and Mass Transfer/Waerme- und Stoffuebertragung[ISSN 0947-7411], v. 56, p. 3085–3092 |
Colección: | Artículos |
Citas SCOPUSTM
8
actualizado el 17-nov-2024
Citas de WEB OF SCIENCETM
Citations
7
actualizado el 17-nov-2024
Visitas
101
actualizado el 18-may-2024
Google ScholarTM
Verifica
Altmetric
Comparte
Exporta metadatos
Los elementos en ULPGC accedaCRIS están protegidos por derechos de autor con todos los derechos reservados, a menos que se indique lo contrario.