Please use this identifier to cite or link to this item: http://hdl.handle.net/10553/58883
DC FieldValueLanguage
dc.contributor.authorMonzón Verona, José Miguelen_US
dc.contributor.authorGonzález Domínguez, Pablo Ignacioen_US
dc.contributor.authorGarcia-Alonso, Santiagoen_US
dc.contributor.authorSantana Martin, Francisco Jorgeen_US
dc.contributor.authorCárdenes Martín, Juan Franciscoen_US
dc.date.accessioned2019-12-17T08:38:56Z-
dc.date.available2019-12-17T08:38:56Z-
dc.date.issued2019en_US
dc.identifier.issn1424-8220en_US
dc.identifier.otherWoS-
dc.identifier.urihttp://hdl.handle.net/10553/58883-
dc.description.abstractIn this work we analyse the temperature distribution in a conductor disk in transitory regime. The disk is in motion in a stationary magnetic field generated by a permanent magnet and so, the electric currents induced inside it generate heat. The system acts as a magnetic brake and is analysed using infrared sensor techniques. In addition, for the simulation and analysis of the magnetic brake, a new thermal convective matrix for the 3D Cell Method (CM) is proposed. The results of the simulation have been verified by comparing the numerical results with those obtained by the Finite Element Method (FEM) and with experimental data obtained by infrared technology. The difference between the experimental results obtained by infrared sensors and those obtained in the simulations is less than 0.0459%.en_US
dc.languageengen_US
dc.relation.ispartofSensorsen_US
dc.sourceSensors[ISSN 1424-8220],v. 19 (9)en_US
dc.subject3303 ingeniería y tecnología químicasen_US
dc.subject.otherEddy-Current Brakeen_US
dc.subject.otherFormulationen_US
dc.subject.otherEquationsen_US
dc.titleThermal Analysis of a Magnetic Brake Using Infrared Techniques and 3D Cell Method with a New Convective Constitutive Matrixen_US
dc.typeinfo:eu-repo/semantics/Articleen_US
dc.typeArticleen_US
dc.identifier.doi10.3390/s19092028
dc.identifier.scopus85065664371
dc.identifier.isi000469766800072-
dc.contributor.authorscopusid26531597500
dc.contributor.authorscopusid57203973366
dc.contributor.authorscopusid35106946100
dc.contributor.authorscopusid26531766200
dc.contributor.authorscopusid57208735678
dc.identifier.issue9-
dc.relation.volume19-
dc.investigacionIngeniería y Arquitecturaen_US
dc.type2Artículoen_US
dc.contributor.daisngid5659103
dc.contributor.daisngid29126516
dc.contributor.daisngid3654087
dc.contributor.daisngid8865392
dc.contributor.daisngid30210070
dc.utils.revisionen_US
dc.contributor.wosstandardWOS:Monzon-Verona, JM
dc.contributor.wosstandardWOS:Gonzalez-Dominguez, PI
dc.contributor.wosstandardWOS:Garcia-Alonso, S
dc.contributor.wosstandardWOS:Santana-Martin, FJ
dc.contributor.wosstandardWOS:Cardenes-Martin, JF
dc.date.coverdateMayo 2019
dc.identifier.ulpgces
dc.description.sjr0,653
dc.description.jcr3,275
dc.description.sjrqQ1
dc.description.jcrqQ2
dc.description.scieSCIE
item.grantfulltextopen-
item.fulltextCon texto completo-
crisitem.author.deptGIR IUMA: Instrumentación avanzada-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Eléctrica-
crisitem.author.deptGIR IUMA: Instrumentación avanzada-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Eléctrica-
crisitem.author.deptGIR IUMA: Instrumentación avanzada-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Electrónica y Automática-
crisitem.author.deptDepartamento de Ingeniería Mecánica-
crisitem.author.orcid0000-0001-9694-269X-
crisitem.author.orcid0000-0003-4389-0632-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.fullNameMonzón Verona, José Miguel-
crisitem.author.fullNameGonzález Domínguez, Pablo-
crisitem.author.fullNameGarcia-Alonso Montoya, Santiago-
crisitem.author.fullNameSantana Martin, Francisco Jorge-
crisitem.author.fullNameCárdenes Martín, Juan Francisco-
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