Please use this identifier to cite or link to this item: http://hdl.handle.net/10553/46919
Title: A study of stacked and miniature 3-D inductor performance for radio frequency integrated circuit design
Authors: Iturri, A. Goñi
Del Pino, F. J. 
Khemchandani, S. L. 
García, J. 
González, B. 
Hernández, A. 
UNESCO Clasification: 3307 Tecnología electrónica
Keywords: Inductance
Metals
Silicon
3D imaging standars
Integrated circuit design
Capacitance
Interferometric modulator displays
Issue Date: 2007
Journal: Proceedings of SPIE - The International Society for Optical Engineering 
Conference: Conference on VLSI Circuits and Systems III 
Abstract: The performance of stacked and miniature three-dimensional spiral inductors is analyzed and compared to standard planar coils. For this purpose, nine of these new structures have been fabricated in a 0.35-mu m four-metal SiGe process. According to the measurement results, some of the proposed stacked inductors occupy only 48% of the area of a conventional planar inductor with the same inductance value and work frequency. The area reduction is even more significant with the miniature 3-D structures, which occupy only 22% in some cases, and translate the inductor self-resonance frequency to higher values than the conventional stacked inductors. In spite of this area reduction, these new structures employ metal levels close to the substrate, which significantly degrades the quality factor. So the standard planar coils continue to be the best choice if the designer requires high-quality inductors. However, stacked and 3-D miniature structures could be a better solution if the area saving is the circuit major priority.
URI: http://hdl.handle.net/10553/46919
ISBN: 978-0-8194-6718-8
ISSN: 0277-786X
DOI: 10.1117/12.721913
Source: Proceedings of SPIE - The International Society for Optical Engineering[ISSN 0277-786X],v. 6590 (65901C)
Appears in Collections:Actas de congresos
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