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Title: Modeling the package of a LNA with a 3D-EM simulator
Authors: García-Vázquez, Hugo 
Khemchandani, Sunil L. 
Ramos-Valido, Dailos 
Orbaiceta-Ezcurra, Krisnaya
Del Pino, Javier 
UNESCO Clasification: 3307 Tecnología electrónica
Keywords: Low noise amplifiers
Feedback amplifiers
Integrated circuits
Electric inductance, et al
Issue Date: 2013
Publisher: 0895-2477
Journal: Microwave and Optical Technology Letters 
Abstract: In this work, the package influence on a feedback low‐noise amplifier has been studied.The electromagnetic simulator of ADS was used to obtain the QFN16 package model and the bonding model. The influence of the package and the pad on the supply node was negligible when it was studied separately. However, the circuit performance is reduced when the inductance introduced by the bonding of the supply node is combined with the parasitic capacities associated to the pad with electrostatic discharge protection.
ISSN: 0895-2477
DOI: 10.1002/mop.27601
Source: Microwave and Optical Technology Letters[ISSN 0895-2477],v. 55, p. 1435-1440
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