|Title:||Modeling the package of a LNA with a 3D-EM simulator||Authors:||García-Vázquez, Hugo
Khemchandani, Sunil L.
Del Pino, Javier
|UNESCO Clasification:||3307 Tecnología electrónica||Keywords:||Low noise amplifiers
Electric inductance, et al
|Issue Date:||2013||Publisher:||0895-2477||Journal:||Microwave and Optical Technology Letters||Abstract:||In this work, the package influence on a feedback low‐noise amplifier has been studied.The electromagnetic simulator of ADS was used to obtain the QFN16 package model and the bonding model. The influence of the package and the pad on the supply node was negligible when it was studied separately. However, the circuit performance is reduced when the inductance introduced by the bonding of the supply node is combined with the parasitic capacities associated to the pad with electrostatic discharge protection.||URI:||http://hdl.handle.net/10553/45419||ISSN:||0895-2477||DOI:||10.1002/mop.27601||Source:||Microwave and Optical Technology Letters[ISSN 0895-2477],v. 55, p. 1435-1440|
|Appears in Collections:||Artículos|
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