Please use this identifier to cite or link to this item:
http://hdl.handle.net/10553/119056
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lazaro, M | en_US |
dc.contributor.author | Lazaro, A | en_US |
dc.contributor.author | González, B. | en_US |
dc.contributor.author | Villarino, R | en_US |
dc.contributor.author | Girbau, D | en_US |
dc.date.accessioned | 2022-10-26T09:14:58Z | - |
dc.date.available | 2022-10-26T09:14:58Z | - |
dc.date.issued | 2022 | en_US |
dc.identifier.issn | 1424-8220 | en_US |
dc.identifier.uri | http://hdl.handle.net/10553/119056 | - |
dc.description.abstract | The present study exposes an economical and easy-to-use system to assess the heat transfer in building envelopes by determining the U-value. Nowadays these systems require long wires and a host to collect and process the data. In this work, a multi-point system for simultaneous heat flux measurement has been proposed. The aim is to reduce the long measurement time and the cost of thermal isolation evaluations in large buildings. The system proposed consists of a low-cost 3D-printed heat flux sensor integrated with a LoRa transceiver and two temperature sensors. The heat flux (HF) sensor was compared and calibrated with a commercial HF sensor from the Fluxteq brand. | en_US |
dc.language | spa | en_US |
dc.relation | Nuevas soluciones para la próxima generación de dispositivos y sensores IOT | en_US |
dc.relation.ispartof | Sensors (Switzerland) | en_US |
dc.subject | 3325 Tecnología de las telecomunicaciones | en_US |
dc.subject.other | heat flux sensor | en_US |
dc.subject.other | U-value | en_US |
dc.subject.other | LoRa | en_US |
dc.subject.other | thermal isolation | en_US |
dc.subject.other | 3D printed | en_US |
dc.subject.other | low cost | en_US |
dc.title | Long-Range Wireless System for U-Value Assessment Using a Low-Cost Heat Flux Sensor | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.3390/s22197259 | en_US |
dc.identifier.scopus | 2-s2.0-85139953545 | - |
dc.identifier.isi | WOS:000867285100001 | - |
dc.contributor.orcid | 0000-0002-8930-1170 | - |
dc.contributor.orcid | 0000-0003-3160-5777 | - |
dc.contributor.orcid | 0000-0001-6864-9736 | - |
dc.contributor.orcid | 0000-0001-9692-8943 | - |
dc.contributor.orcid | 0000-0001-7995-5536 | - |
dc.identifier.issue | 19 | - |
dc.investigacion | Ingeniería y Arquitectura | en_US |
dc.utils.revision | Sí | en_US |
dc.identifier.ulpgc | Sí | en_US |
dc.contributor.buulpgc | BU-TEL | en_US |
dc.description.sjr | 0,803 | |
dc.description.jcr | 3,847 | |
dc.description.sjrq | Q1 | |
dc.description.jcrq | Q1 | |
dc.description.scie | SCIE | |
dc.description.miaricds | 10,8 | |
item.grantfulltext | open | - |
item.fulltext | Con texto completo | - |
crisitem.author.dept | GIR IUMA: Tecnología Microelectrónica | - |
crisitem.author.dept | IU de Microelectrónica Aplicada | - |
crisitem.author.dept | Departamento de Ingeniería Electrónica y Automática | - |
crisitem.author.orcid | 0000-0001-6864-9736 | - |
crisitem.author.parentorg | IU de Microelectrónica Aplicada | - |
crisitem.author.fullName | González Pérez, Benito | - |
Appears in Collections: | Artículos |
SCOPUSTM
Citations
2
checked on Nov 17, 2024
WEB OF SCIENCETM
Citations
2
checked on Nov 17, 2024
Page view(s)
49
checked on May 18, 2024
Download(s)
36
checked on May 18, 2024
Google ScholarTM
Check
Altmetric
Share
Export metadata
Items in accedaCRIS are protected by copyright, with all rights reserved, unless otherwise indicated.