Please use this identifier to cite or link to this item: http://hdl.handle.net/10553/119056
DC FieldValueLanguage
dc.contributor.authorLazaro, Men_US
dc.contributor.authorLazaro, Aen_US
dc.contributor.authorGonzález, B.en_US
dc.contributor.authorVillarino, Ren_US
dc.contributor.authorGirbau, Den_US
dc.date.accessioned2022-10-26T09:14:58Z-
dc.date.available2022-10-26T09:14:58Z-
dc.date.issued2022en_US
dc.identifier.issn1424-8220en_US
dc.identifier.urihttp://hdl.handle.net/10553/119056-
dc.description.abstractThe present study exposes an economical and easy-to-use system to assess the heat transfer in building envelopes by determining the U-value. Nowadays these systems require long wires and a host to collect and process the data. In this work, a multi-point system for simultaneous heat flux measurement has been proposed. The aim is to reduce the long measurement time and the cost of thermal isolation evaluations in large buildings. The system proposed consists of a low-cost 3D-printed heat flux sensor integrated with a LoRa transceiver and two temperature sensors. The heat flux (HF) sensor was compared and calibrated with a commercial HF sensor from the Fluxteq brand.en_US
dc.languagespaen_US
dc.relationNuevas soluciones para la próxima generación de dispositivos y sensores IOTen_US
dc.relation.ispartofSensors (Switzerland)en_US
dc.subject3325 Tecnología de las telecomunicacionesen_US
dc.subject.otherheat flux sensoren_US
dc.subject.otherU-valueen_US
dc.subject.otherLoRaen_US
dc.subject.otherthermal isolationen_US
dc.subject.other3D printeden_US
dc.subject.otherlow costen_US
dc.titleLong-Range Wireless System for U-Value Assessment Using a Low-Cost Heat Flux Sensoren_US
dc.typeArticleen_US
dc.identifier.doi10.3390/s22197259en_US
dc.identifier.scopus2-s2.0-85139953545-
dc.identifier.isiWOS:000867285100001-
dc.contributor.orcid0000-0002-8930-1170-
dc.contributor.orcid0000-0003-3160-5777-
dc.contributor.orcid0000-0001-6864-9736-
dc.contributor.orcid0000-0001-9692-8943-
dc.contributor.orcid0000-0001-7995-5536-
dc.identifier.issue19-
dc.investigacionIngeniería y Arquitecturaen_US
dc.utils.revisionen_US
dc.identifier.ulpgcen_US
dc.contributor.buulpgcBU-TELen_US
dc.description.sjr0,803
dc.description.jcr3,847
dc.description.sjrqQ1
dc.description.jcrqQ1
dc.description.scieSCIE
dc.description.miaricds10,8
item.grantfulltextopen-
item.fulltextCon texto completo-
crisitem.author.deptGIR IUMA: Tecnología Microelectrónica-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Electrónica y Automática-
crisitem.author.orcid0000-0001-6864-9736-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.fullNameGonzález Pérez, Benito-
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