Please use this identifier to cite or link to this item: http://hdl.handle.net/10553/76698
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dc.contributor.authorSocorro, Miguelen_US
dc.contributor.authorMacías-Machín, Agustínen_US
dc.contributor.authorMonzón Verona, José Miguelen_US
dc.contributor.authorSantana, Domingoen_US
dc.date.accessioned2020-12-15T14:02:45Z-
dc.date.available2020-12-15T14:02:45Z-
dc.date.issued2006en_US
dc.identifier.issn0888-5885en_US
dc.identifier.otherWoS-
dc.identifier.urihttp://hdl.handle.net/10553/76698-
dc.description.abstractA study was conducted on gas filtration and heat exchange in a fixed-bed heat exchanger-filter (FHEF) where we have removed fine dust particles from gases and exchanged heat with the granular medium (Lapilli). The influence of a number of variables was examined including gas velocities, gas temperatures, concentration of dust, height of the FHEF, dust and granular mean size, and pressure drop. The collection efficiency was found to decrease with increasing temperature, and the pressure drop increases when the size of the granular medium decreases. A numerical model for gas filtration and heat exchange using the finite element method was developed. It predicts the two-dimensional transient response of both solid and fluid phases as well as the variation of the specific deposit and void fraction of the FHEF with time. The numerical model incorporates variation in void fraction, specific surface area of the medium, and transport coefficient because of the combined processes of filtration and heat exchange.en_US
dc.languageengen_US
dc.relation.ispartofIndustrial & Engineering Chemistry Researchen_US
dc.sourceIndustrial & Engineering Chemistry Research [ISSN 0888-5885], v. 45 (23), p. 7957-7966, (Noviembre 2006)en_US
dc.subject330311 Química industrialen_US
dc.subject.otherParticle Mixturesen_US
dc.subject.otherFilteren_US
dc.subject.otherPorosityen_US
dc.subject.otherModelen_US
dc.titleHot gas filtration and heat exchange in a packed bed using Lapilli as a granular mediumen_US
dc.typeinfo:eu-repo/semantics/Articleen_US
dc.typeArticleen_US
dc.identifier.doi10.1021/ie060354ken_US
dc.identifier.scopus37849187603-
dc.identifier.isi000241702300026-
dc.contributor.authorscopusid16314283500-
dc.contributor.authorscopusid6701534134-
dc.contributor.authorscopusid13410244400-
dc.contributor.authorscopusid57203231819-
dc.description.lastpage7966en_US
dc.identifier.issue23-
dc.description.firstpage7957en_US
dc.relation.volume45en_US
dc.investigacionIngeniería y Arquitecturaen_US
dc.type2Artículoen_US
dc.contributor.daisngid12866689-
dc.contributor.daisngid4014777-
dc.contributor.daisngid11877956-
dc.contributor.daisngid593630-
dc.description.numberofpages10en_US
dc.utils.revisionen_US
dc.contributor.wosstandardWOS:Socorro, M-
dc.contributor.wosstandardWOS:Macias-Machin, A-
dc.contributor.wosstandardWOS:Verona, JM-
dc.contributor.wosstandardWOS:Santana, D-
dc.date.coverdateNoviembre 2006en_US
dc.identifier.ulpgcen_US
dc.description.jcr1,518
dc.description.jcrqQ1
dc.description.scieSCIE
item.fulltextCon texto completo-
item.grantfulltextopen-
crisitem.author.deptGIR IUMA: Instrumentación avanzada-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Eléctrica-
crisitem.author.orcid0000-0001-9694-269X-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.fullNameMonzón Verona, José Miguel-
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