Identificador persistente para citar o vincular este elemento: http://hdl.handle.net/10553/41461
Campo DC Valoridioma
dc.contributor.authorGonzález Domínguez, Pablo Ignacioen_US
dc.contributor.authorMonzón-Verona, José Miguelen_US
dc.contributor.authorSimón Rodríguez, Leopoldoen_US
dc.contributor.authorDe Pablo Sánchez, Adriánen_US
dc.date.accessioned2018-07-04T08:08:39Z-
dc.date.available2018-07-04T08:08:39Z-
dc.date.issued2018en_US
dc.identifier.issn2391-5471en_US
dc.identifier.urihttp://hdl.handle.net/10553/41461-
dc.description.abstractThis work demonstrates the equivalence of two constitutive equations. One is used in Fourier's law of the heat conduction equation, the other in electric conduction equation; both are based on the numerical Cell Method, using the Finite Formulation (FF-CM). A 3-D pure heat conduction model is proposed. The temperatures are in steady state and there are no internal heat sources. The obtained results are compared with an equivalent model developed using the Finite Elements Method (FEM). The particular case of 2-D was also studied. The errors produced are not significant at less than 0.2%. The number of nodes is the number of the unknowns and equations to resolve. There is no significant gain in precision with increasing density of the mesh.en_US
dc.languageengen_US
dc.relation.ispartofOpen Physicsen_US
dc.sourceOpen Physics [ISSN 2391-5471], v. 16, p. 27-30en_US
dc.subject3322 Tecnología energéticaen_US
dc.subject.otherFinite formulationen_US
dc.subject.otherCell methoden_US
dc.subject.otherThermal constitutive matrixen_US
dc.subject.other3-D heat tansmission modelsen_US
dc.subject.otherFinite elements methoden_US
dc.titleThermal constitutive matrix applied to asynchronous electrical machine using the cell methoden_US
dc.typeinfo:eu-repo/semantics/Articleen_US
dc.typeArticleen_US
dc.relation.conference18th International Symposium on Electromagnetic Fields in Mechatronics, Electrical and Electronic Engineering (ISEF )
dc.identifier.doi10.1515/phys-2018-0005en_US
dc.identifier.scopus85043569777-
dc.identifier.isi000428760100005-
dc.contributor.authorscopusid57201156273-
dc.contributor.authorscopusid26531597500-
dc.contributor.authorscopusid57201152270-
dc.contributor.authorscopusid57201154342-
dc.description.lastpage30en_US
dc.identifier.issue1-
dc.description.firstpage27en_US
dc.relation.volume16en_US
dc.investigacionIngeniería y Arquitecturaen_US
dc.type2Artículoen_US
dc.contributor.daisngid13807649-
dc.contributor.daisngid5659103-
dc.contributor.daisngid20795786-
dc.contributor.daisngid11247051-
dc.utils.revisionen_US
dc.contributor.wosstandardWOS:Dominguez, PIG-
dc.contributor.wosstandardWOS:Monzon-Verona, JM-
dc.contributor.wosstandardWOS:Rodriguez, LS-
dc.contributor.wosstandardWOS:Sanchez, AD-
dc.date.coverdateEnero 2018en_US
dc.identifier.conferenceidevents121098-
dc.identifier.ulpgcen_US
dc.contributor.buulpgcBU-TELen_US
dc.description.sjr0,237
dc.description.jcr1,005
dc.description.sjrqQ3
dc.description.jcrqQ3
dc.description.scieSCIE
item.grantfulltextopen-
item.fulltextCon texto completo-
crisitem.event.eventsstartdate14-09-2017-
crisitem.event.eventsenddate16-09-2017-
crisitem.author.deptGIR IUMA: Instrumentación avanzada-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Eléctrica-
crisitem.author.deptGIR IUMA: Instrumentación avanzada-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Eléctrica-
crisitem.author.orcid0000-0001-9694-269X-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.fullNameGonzález Domínguez, Pablo-
crisitem.author.fullNameMonzón Verona, José Miguel-
Colección:Artículos
miniatura
pdf
Adobe PDF (795,25 kB)
Vista resumida

Google ScholarTM

Verifica

Altmetric


Comparte



Exporta metadatos



Los elementos en ULPGC accedaCRIS están protegidos por derechos de autor con todos los derechos reservados, a menos que se indique lo contrario.