Identificador persistente para citar o vincular este elemento: https://accedacris.ulpgc.es/jspui/handle/10553/162810
Título: Towards hyper-personalized travel planning: a multimodal AI agent with integrated neural rendering for immersive itineraries
Autores/as: Marquez-Algaba, Jose
Vicente-Martinez, Pablo
Soria-Olivas, Emilio
Sanchez-Montanes, Manuel
Garcia-Escriva, Maria Angeles
William Secín, Eduardo 
Clasificación UNESCO: 531290 Economía sectorial: turismo
3325 Tecnología de las telecomunicaciones
Palabras clave: Tourism
Ai Agents
Large Language Models
Tool Calling
3D Gaussian Splatting, et al.
Fecha de publicación: 2026
Publicación seriada: Electronics 
Resumen: The digital transformation of the tourism industry faces a dual challenge: the fragmentation of data across platforms and the lack of immersive "try-before-you-buy" experiences. While Large Language Models (LLMs) have revolutionized information synthesis, they typically lack real-time visual verification capabilities. This paper proposes a novel, multimodal AI Agent architecture that integrates advanced natural language planning with photorealistic 3D visualization. We present a system where a conversational agent, powered by Gemini 2.5 Flash, orchestrates a suite of dynamic tools to build structured travel itineraries (flights, hotels, activities) while simultaneously deploying a neural rendering engine. This engine utilizes a modular Structure-from-Motion (SfM) pipeline feeding into 3D Gaussian Splatting (3DGS) to render navigable, high-fidelity digital twins of hotel facilities directly within the chat interface. Positioned as a Technology Readiness Level 4 (TRL 4) proof of concept (PoC), this work demonstrates the technical feasibility of the multimodal integration between conversational logic and automated visual synthesis. The results demonstrate the technical feasibility of a pipeline that dynamically binds LLM inference to 3D spatial data, providing a foundation for high-fidelity, interactive travel consultancy.
URI: https://accedacris.ulpgc.es/jspui/handle/10553/162810
ISSN: 2079-9292
DOI: 10.3390/electronics15061142
Fuente: Electronics[ISSN 2079-9292],v. 15 (6), (Marzo 2026)
Colección:Artículos
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