Identificador persistente para citar o vincular este elemento: http://hdl.handle.net/10553/123443
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dc.contributor.authorDíez-Acereda, Victoria Youen_US
dc.contributor.authorLalchand Khemchandani, Sunilen_US
dc.contributor.authorDel Pino Suárez, Francisco Javieren_US
dc.contributor.authorDiaz-Carballo, Ayozeen_US
dc.date.accessioned2023-06-12T13:55:56Z-
dc.date.available2023-06-12T13:55:56Z-
dc.date.issued2023en_US
dc.identifier.issn2072-666Xen_US
dc.identifier.urihttp://hdl.handle.net/10553/123443-
dc.description.abstractA comparison between a fully integrated Doherty power amplifier (DPA) and outphasing power amplifier (OPA) for fifth Generation (5G) wireless communications is presented in this paper. Both amplifiers are integrated using pHEMT transistors from the OMMIC’s 100 nm GaN-on-Si technology (D01GH). After a theoretical analysis, the design and layout of both circuits are presented. The DPA uses an asymmetric configuration where the main amplifier is biased in class AB and the auxiliary amplifier is biased in class C, while the OPA uses two amplifiers biased in class B. In the comparative analysis, it has been observed that the OPA presents a better performance in terms of maximum power added efficiency (PAE), while the DPA provides higher linearity and efficiency at 7.5 dB output back-off (OBO). At a 1 dB compression point, the OPA exhibits an output power of 33 dBm with a maximum PAE of 58.3% compared to 44.2% for the DPA for an output power of 35 dBm, and at 7.5 dB OBO, the DPA achieves a PAE of 38.5%, while the OPA achieves 26.1%. The area has been optimized using absorbing adjacent component techniques, resulting in an area of 3.26 mm2 for the DPA and 3.18 mm2 for the OPA.en_US
dc.languageengen_US
dc.relation.ispartofMicromachinesen_US
dc.subject330790 Microelectrónicaen_US
dc.titleA Comparative Analysis of Doherty and Outphasing MMIC GaN Power Amplifiers for 5G Applicationsen_US
dc.typeArticleen_US
dc.identifier.doihttps://doi.org/10.3390/mi14061205en_US
dc.identifier.issue6-
dc.investigacionIngeniería y Arquitecturaen_US
dc.utils.revisionen_US
dc.identifier.ulpgcen_US
dc.contributor.buulpgcBU-TELen_US
dc.description.sjr0,546
dc.description.jcr3,4
dc.description.sjrqQ2
dc.description.jcrqQ2
dc.description.scieSCIE
dc.description.miaricds10,5
item.grantfulltextopen-
item.fulltextCon texto completo-
crisitem.author.deptGIR IUMA: Tecnología Microelectrónica-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptGIR IUMA: Tecnología Microelectrónica-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Electrónica y Automática-
crisitem.author.deptGIR IUMA: Tecnología Microelectrónica-
crisitem.author.deptIU de Microelectrónica Aplicada-
crisitem.author.deptDepartamento de Ingeniería Electrónica y Automática-
crisitem.author.orcid0000-0003-0315-4622-
crisitem.author.orcid0000-0003-0087-2370-
crisitem.author.orcid0000-0003-2610-883X-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.parentorgIU de Microelectrónica Aplicada-
crisitem.author.fullNameDíez Acereda, Victoria You-
crisitem.author.fullNameLalchand Khemchandani, Sunil-
crisitem.author.fullNameDel Pino Suárez, Francisco Javier-
Colección:Artículos
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