Please use this identifier to cite or link to this item: http://hdl.handle.net/10553/118971
Title: Spectral Signature Multiplexing in Multispectral Camera Communication
Authors: Moreno, Daniel 
Guerra Yanez, Victor 
Rufo Torres, Julio Francisco 
Rabadán Borges, José Alberto 
Perez-Jimenez, Rafael 
UNESCO Clasification: 3325 Tecnología de las telecomunicaciones
Keywords: Optical camera communication
Multispectral
Light-emitting diodes
Temperature effect
Issue Date: 2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE) 
Conference: 13th International Symposium on Communication Systems, Networks and Digital Signal Processing (CSNDSP 2022) 
Abstract: Optical camera communication (OCC) is a technology foreseen to have a fundamental role in future communication applications due to the ubiquity of the cameras embedded in most consumer electronic devices and their increasing capabilities (high resolution, scanning frequency, etcetera). However, high-spectral-resolution cameras, such as multispectral cameras, present particular characteristics that can be exploited to provide new features to OCC links. Furthermore, as LED spectral responses are different when their temperature changes, more than one communication channel can be achieved using the same LED device if the camera can capture those modifications and distinguish the different LED spectral signatures due to the temperature variation. This novel approach is followed in this research, including some equalization techniques applied to the channel matrix to improve the extraction of the transmitted signal in the receiver reducing the inter-channel interference (ICI). This work shows that up to two distinct channels can be obtained with the same LED at different temperatures, getting a bit error rate (BER) below the forward error correction (FEC) limit.
URI: http://hdl.handle.net/10553/118971
ISBN: 978-1-6654-1044-1
DOI: 10.1109/CSNDSP54353.2022.9907907
Source: 2022 13th International Symposium on Communication Systems, Networks and Digital Signal Processing (CSNDSP), 2022, p. 515-520
Appears in Collections:Actas de congresos
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